PLDA, the industry leader in PCI Express® controller IP solutions and Samtec, a privately held $800MM global manufacturer of a…
Toshiba Electronics Europe (“Toshiba”) today announced the launch of an addition to its line-up of dual H-bridge driver ICs for…
Stuttgart – Daimler is taking the next step towards securing its CASE corporate strategy. The company already plays a leading…
Working with a number of partners on the BodySense project, CPI is supporting the development of next generation multi-functional sensing…
Rohde & Schwarz has signed a procurement and maintenance contract with the Defense Acquisition and Logistics Organization (DALO) of the Danish…
Samsung Electronics announced today that it has partnered with three prominent global museums and art galleries, Uffizi Galleries (Italy), Museum…
Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company, has completed a multi-million dollar project by delivering hundreds of CCD250 sensors…
u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies, has announced the results of its collaboration with…
Munich. The BMW Group is increasingly relying on innovations from the fields of digitalisation and Industry 4.0 in production logistics.…
Ficosa, top-tier global provider devoted to the research, development, manufacturing and marketing of high-technology vision, safety, connectivity and efficiency systems…