Researchers around the globe have been on a quest for batteries that pack a punch but are smaller and lighter…
XP’s end-to-end cloud service MIFARE 2GO enables mobile ticketing in multiple transportation modes and provides scalability across all Android NFC…
PHOENIX, April 1, 2019 – Intel Capital, Intel Corporation’s global investment organization, announced today at the Intel Capital Global Summit…
LEUVEN (Belgium), MARCH 28, 2019 — In order to safeguard the future of its knowledge economy, Europe is in need…
CPI has welcomed Silent Sensors, Datatecnics Corporation and HP1 as new tenants to its cutting-edge Printable Electronics Centre. The printable…
Assembled from tiny identical pieces, the wing could enable lighter, more energy-efficient aircraft designs. A team of engineers has built…
TowerJazz, the global specialty foundry leader, and TowerJazz Panasonic Semiconductor Company (TPSCo), today announced they have signed a three-year agreement,…
ON Semiconductor Corporation (Nasdaq: ON) (“ON Semiconductor”), and Quantenna Communications, Inc. (Nasdaq: QTNA) (“Quantenna”) today announced that they have entered into a…
IC Insights published its updated 2019-2023 semiconductor market forecasts and top-40 IDM and top-50 fabless IC company sales rankings in…
Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company, has released a new image sensor package, the CIS120. Samples are now…