Analog Devices launched a pair of highly integrated microwave upconverter and downconverter chips, the ADMV1013 and the ADMV1014, respectively. These…
System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling…
ERNI has expanded and optimized its production capacities over the last few months through target measures in order to meet…
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the Renesas RX65N Cloud Kit featuring onboard…
Being part of the same power supply family, both, the R&S NGL200 and the new R&S NGM200 series, offer the same superb performance and…
Munich. On the occasion of the BMW iNEXT prototype production, the BMW Group is offering an exclusive glimpse behind the scenes…
The area is ready for all kinds of demos exploring the opportunities of 5G, including immersive VR entertainment, smart buildings…
Digital ISELED LED technology opens up new possibilities in interior lighting and beyond Munich and Darmstadt, 23 August 2019 –…
Rohde & Schwarz working together with Vector, Savari and Quectel presented a test solution for C V2X at the MWC…
New Virtex UltraScale+ Device Enables the Creation of Tomorrow’s Most Complex Technologies SAN JOSE, Calif., August 21, 2019 – Xilinx,…