German service provider Deutsche Telekom and Ericsson have announced a strategic campus networks partnership to address the growing market demand…
HAMBURG, Germany, Aug. 27, 2019 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ: NXPI) and Volkswagen have shared early glimpses into Ultra-Wideband…
Researchers from Carnegie Mellon University (CMU) and Nanyang Technological University, Singapore (NTU Singapore) have developed an organ-on-an-electronic-chip platform, which uses…
Siemens has been awarded a contract to deliver two converter stations for the first high-voltage direct-current (HVDC) link between Great…
CyBox RT 2-A extends wireless access point family with dual LTE/WiFi router for automotive electronics Mainz, August 2019 – ELTEC…
Analog Devices launched a pair of highly integrated microwave upconverter and downconverter chips, the ADMV1013 and the ADMV1014, respectively. These…
System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling…
ERNI has expanded and optimized its production capacities over the last few months through target measures in order to meet…
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the Renesas RX65N Cloud Kit featuring onboard…
Being part of the same power supply family, both, the R&S NGL200 and the new R&S NGM200 series, offer the same superb performance and…