eledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces that it has expanded its…
Pontoise/Bruchsal, 30 September 2020 - In the current context of environmental transition in air transport, economic recovery, and urban densification,…
TI makes it easy to select, evaluate and verify components for new designs with new simulation and analysis tool from…
World’s first solution to integrate Si driver and GaN power transistors in one package Enables chargers and adapters 80% smaller…
Tokyo, Japan—Sony Corporation announced today the upcoming release of high-precision Global Navigation Satellite System (GNSS) receiver LSIs for use in…
New Data-Center-Infrastructure-on-a-Chip Software — DOCA SDK — Enables Developers to Create New DPU-Accelerated Infrastructure Applications; VMware Announces NVIDIA BlueField-2 Support…
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the expansion of its RA6…
Harwin is expanding its services relating to the Gecko-MT high-reliability (Hi-Rel) connector series. Enabling significant reductions in weight and space, Gecko-MT robust…
Nokia and Finland’s Tampere University join forces to develop 5G chipsets Joint venture creates foundation for long-term development of silicon-based…
Ericsson interviewed 25 original equipment manufacturers (OEMs) in different sectors to reveal six key drivers that will change the trajectory…