Compact High Pin Count 0.8mm Pitch Mezzanine Connectors Target High-Density Industrial Systems

5 years ago

Portsmouth, UK, 22 September 2021 – Expanding their product offering for industrial markets, Harwin now announces the Archer .8 series.…

Tiny Power Management IC from Analog Devices Charges Wearables and Hearables Four Times Faster

5 years ago

MAX77659 SIMO PMIC with built-in switching charger reduces bill of materials by 60 percent Wilmington, Mass. – Sept. 21, 2021…

Dutch AI Semiconductor Startup Axelera AI Launches With $12 Million Seed Round

5 years ago

Stealth company incubated by blockchain unicorn Bitfury Group and global nanoelectronics R&D center imec Eindhoven, Netherlands – September 15, 2021— AI semiconductor…

NI Collaborates with EA Elektro-Automatik to Accelerate Battery Test for Electric Vehicles

5 years ago

NI (NASDAQ: NATI) today announced it collaborated with EA Elektro-Automatik (EA) GmbH & Co. KG, Germany’s leading manufacturer of laboratory…

Teledyne e2v introduces the industry’s smallest 2MP & 1.5MP CMOS sensors, featuring a low-noise global shutter pixel

5 years ago

New Topaz sensors are ideal for mobile applications, offering an attractive price point with no-compromise performance. Grenoble, FRANCE, September, 2021…

University of Birmingham partners with Siemens to create the smartest university campus in the world

5 years ago

The University of Birmingham, in partnership with Siemens, is combining digital sensor and analytics technologies, artificial intelligence, decentralized energy generation…

Intel Processors Selected to Power Next-Gen DOE Supercomputers

5 years ago

Next-gen Intel Xeon Scalable processors to provide expanded computing resources for the NNSA's stockpile stewardship mission. The U.S. Department of…

Infineon opens high-tech chip factory for power electronics on 300-millimeter thin wafers

5 years ago

Munich, Germany, and Villach, Austria, 17 September 2021 – Infineon Technologies AG today officially opened its high-tech chip factory for…

Melexis and emotion3D combine DMS and HUD dynamic object alignment in a single camera

5 years ago

Tessenderlo, Belgium, 20 September 2021 - Melexis, a global leader in automotive semiconductors, and emotion3D, a leading provider of camera-based…

Reduce Switching Losses up to 50% While Accelerating Time to Market with the First Fully Configurable Digital Gate Driver for Silicon Carbide MOSFETs – Now Production Ready

5 years ago

New technology enables electric buses and other e-transportation power systems to meet and exceed stringent environmental conditions while maximizing efficiency…