, New Honeywell proximity sensors are rugged and reliable in extreme environments – now from TTI, Inc.
, New Honeywell proximity sensors are rugged and reliable in extreme environments – now from TTI, Inc.

BioMensio Ltd is set to develop a novel handheld bio-screening sensor and associated services with €2.5 million funding

BioMensio Ltd, announces today a €2.5 million funding round from private investors, VTT Ventures, Siemens Technology Accelerator and Tekes, the Finnish Funding Agency for Innovation.

BioMensio Ltd, announces today a €2.5 million funding round from private investors, VTT Ventures, Siemens Technology Accelerator and Tekes, the Finnish Funding Agency for Innovation. In addition to the capital injection, the investor consortium provides BioMensio with access to extensive knowledge and an industry network.

“BioMensio is now set to develop a smart handheld bio-screening sensor and associated cloud services to determine the presence of specific biomolecules. Rapid and accurate on-site testing enables fast and targeted action in the presence of multiple unwanted substances from a biological liquid based sample. The BioMensio biosensors allow cost efficient application development for businesses and governmental organizations in food and beverage, healthcare, security and defense segments as well as environmental monitoring area”, comments Ilari Antila, CEO.

Universality and simplicity are the main advantages of BioMensio label-free technologies. No labelling or analyte modifications are necessary unlike with traditional techniques. This makes the BioMensio sensor inherently universal and applicable to any analyte, or even DNA, on the lab-on-a-chip platform.

Joni Leinvuo, CTO BioMensio: “BioMensio devices will be powered by cost effective, well-scaling Mass- Sensitive Micro-Array (MSMA) technology. The sensing platform consists of microfluidics and an array of microscopic weighing scale pixels. Mass sensitive transducer chips are based on patented BioMensio Film-Bulk Acoustic Resonance (FBAR) technology combined with Application Specific Integrated Circuits (ASIC) – two technologies largely applied in high volume mobile device industries.”

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