Cadence has introduced AuraStack, a new Agentic AI platform designed to automate and orchestrate the complete development process for printed circuit boards (PCBs) and advanced semiconductor packaging. The platform brings together AI-driven design, engineering analysis and multi-physics simulation into a unified workflow, enabling engineering teams to accelerate development while improving design quality.
Built on the Cadence Allegro AI Studio, AuraStack coordinates multiple specialized AI agents across PCB layout, advanced packaging, system implementation and signoff, while integrating electrical, thermal and mechanical analysis throughout the design cycle. According to Cadence, this approach enables engineering teams to identify design issues earlier, reduce costly board respins and optimize overall system performance before physical prototypes are built.
The company says the platform can reduce time-to-market by up to two times while improving engineering productivity by as much as 15x through AI-driven automation, intelligent design exploration and continuous multi-physics optimization.
AuraStack extends Cadence’s growing portfolio of Agentic AI solutions, complementing the company’s ChipStack, InnoStack and ViraStack platforms. Together, these technologies are intended to provide AI-assisted orchestration across the entire electronic system development flow, from silicon design through advanced packaging to PCB implementation.
Cadence also announced collaborations with major industry partners, including NVIDIA and TSMC, to accelerate AI-driven workflows for increasingly complex multi-chip systems. NVIDIA is using the platform to automate system design processes for next-generation AI infrastructure, while TSMC is working with Cadence to support advanced packaging design for its 3DFabric® technologies.
The platform targets high-performance applications such as AI infrastructure, hyperscale data centers, high-performance computing (HPC), automotive electronics, aerospace and defense, where system complexity and advanced packaging requirements continue to grow.
Source: Cadence.
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