Samtec Inks Second-Source License Agreement with Molex to Expand Reach of Si-Fly HD High-Speed Interconnects for Data Center and AI Applications

Samtec, Inc., the service leader in the connector industry and a premier provider of high-speed connectivity solutions, and Molex, a global electronics leader and connectivity innovator, today announced a license agreement naming Molex as a second source for the Samtec Si-Fly® HD product family. This collaboration provides customers with extended product availability and supply flexibility to a portfolio of robust, scalable connectivity solutions for a wide range of high-performance applications demanding high signal integrity and density.

The Si-Fly HD product family delivers industry-leading signal integrity for high-speed applications and supports data rates critical for modern networking, communications, and computing systems. As part of the agreement, Molex will manufacture and distribute these interconnects to customers worldwide, ensuring uninterrupted access to advanced connectivity solutions, while benefiting from the combined engineering and support expertise of both teams.

“Collaborating with Molex as a second source for Si-Fly HD demonstrates our commitment to providing customers with reliable worldwide supply and exceptional technical support,” said Brian Vicich, CTO of Samtec. “Molex’s manufacturing capabilities, deep engineering expertise, and global reach make them an ideal resource to extend the availability of this high-performance interconnect family.”

The agreement reflects a strategic alignment between industry leaders focused on delivering high-speed, high-density interconnect solutions for a wide range of data center, high-performance computing, artificial intelligence and machine learning applications. Customers can expect the same quality, form, fit, and function from Molex’s Si-Fly HD products, ensuring seamless integration into existing Samtec-based systems.

“Working together strengthens our commitment to providing customers with greater optionality and supply flexibility, while expanding our product portfolio,” said Jairo Guerrero, vice president & general manager, Copper Solutions, Molex. “By combining our technical expertise with Samtec’s innovative technology, we’re ensuring customers have seamless access to high-performance interconnect solutions that support their evolving design and supply chain needs.” 

High-Performance Product Showcase at AI Infra Summit

Samtec will showcase and demonstrate high-performance copper and optical interconnects, including the Si-Fly HD family, at Booth #304 at the AI Infra Summit, September 9-11 at the Santa Clara Convention Center. Matthew Burns, global director, Technical Marketing, will present a networking session on Wednesday, September 10, at 2:20 p.m., entitled“Networking: Optimizing and Scaling 224/448 Gbps PAM4 Data Transfers with CPC/CPO in a Single Substrate.”

Credit: Samtec