Samtec Si-Fly® LP, Low-Profile Cable Assemblies Capable of Residing Under IC Cooling Hardware

Samtec’s Si-Fly LP cable assemblies target Data Center, HPC and AI applications where z-axis height is limited near the IC package.

New Albany, IN: Samtec, Inc., the service leader in the connector industry, announces production quantity availability of Si-Fly LP low-profile cable assemblies. The extremely low 4.35 mm mated height of Si-Fly LP cable-to-board assemblies allow side-to-side, front-to-back or belly-to-belly PCB mounting near the IC package, with secure placement under heat sinks or other cooling hardware where z-axis height is limited.

Each Si-Fly LP cable assembly provides 112 Gbps PAM4 channel rate in a 2-row, 16-pair design with aggregate data rates of 896 Gbps (x8 bi-directional) or 1.79 Tbps (x16 uni-directional) and is PCIe 6.0/CXL 3.2 capable. Routing signals from the chip through high-density, high-performance Flyover cable reduces thermal challenges, simplifies board layout and improves overall cost by eliminating expensive re-timers and allowing for fewer board layers and less expensive printed circuit board materials.

Si-Fly LP cable assemblies feature Samtec’s proprietary 34 AWG, 92 Ohm ultra-low-skew Eye Speed twinax cable. Eye Speed twinax enables superior signal integrity performance using advanced co-extrusion techniques that optimize symmetry between signal conductors and shielding, achieving extremely low intrapair skew. Signal reach and integrity become increasingly important in high-speed Data Center, HPC and AI applications where Si-Fly LP is commonly deployed. Each design is unique, so Samtec works with system architects early in the process to create solutions for cable management and thermal load distribution.

Samtec’s Si-Fly LP cable systems (CPC, CPI) are in stock directly from Samtec. For more information on Si-Fly LP, visit samtec.com/SiFly-LP or contact HDR@samtec.com.

Credit: Samtec Inc.