Nordic Semiconductor collaborates with Deutsche Telekom to make everything cellular connected

Introducing MECC: A seamless, scalable solution to unlock global IoT connectivity using nRF9151 module

Nordic Semiconductor, a global leader in low power wireless connectivity solutions, collaborates with Deutsche Telekom, a global leader in integrated telecommunications, to introduce a game-changing IoT solution aimed at enhancing global connectivity for embedded devices. Launching at Mobile World Congress (MWC), Barcelona, March 3-6, the MECC (Make Everything Cellular Connected) solution, based on the nRF9151 System-in-Package, will provide a fully integrated, scalable solution, designed to streamline IoT adoption for developers worldwide. Attendees can explore the innovation at the Deutsche Telekom booth hall 3 at booth 3M31.

At the core of the MECC is Nordic Semiconductor´s nRF9151 cellular module, the lowest-power cellular IoT solution on the market.  Delivering industry-leading battery lifetime performance, the nRF9151 is a highly integrated, globally certified module to significantly streamline IoT connectivity. The nRF9151 will be available through Deutsche Telekom, equipped with a pre-activated, integrated nuSIM. This setup ensures seamless connectivity across Deutsche Telekom’s extensive network and its roaming partners, addressing the critical need for reliable and effortless connectivity in the IoT space.

Industry leaders in partnership

“At last year’s Mobile World Congress, we outlined our vision to achieve universal cellular connectivity,” said Oyvind Birkenes, EVP of Nordic’s Long Range Business Unit. “It’s rewarding to see our vision come to life as we now offer a comprehensive solution with Deutsche Telekom that caters to all OEMs and device makers out there.”

“Nordic Semiconductor’s commitment and dedication to low power, exceptional quality, and a comprehensive approach to cellular technology made them the ideal partner for this pivotal initiative,” said Dennis Nikles, Managing Director of Deutsche Telekom IoT. “This collaboration is set to transform IoT connectivity, making it more accessible and efficient than ever before.”

Bridging the connectivity gap with MECC

Research indicates that only about 25% of smart devices are currently connected via non-cellular networks, posing significant challenges in remote security, device management, user experiences, and supply chain visibility. Deutsche Telekom’s MECC solution aims to close this gap, potentially boosting device connectivity to 100%. This comprehensive package includes connectivity, a modem, location tracking, application hosting, and more, all integrated into the nRF9151’s compact 12×11 mm package.

OEMs and device makers stand to benefit immensely from this streamlined approach. By adopting the MECC solution, they can simplify their supply chains, reduce dependency on managing multiple connectivity solutions, and enhance overall security and network management. Deutsche Telekom will be the single point of contact, delivering the nRF9151 with built-in access to managed network services.

Meet us at MWC

Deutsche Telekom (booth hall 3 at booth 3M31and Nordic Semiconductor (booth #7G21) invite attendees to visit their booths at MWC to see the MECC solution firsthand and explore the vast possibilities it opens up for connected devices worldwide.

In the front, from the left: Vegard Wollan, CEO Nordic Semiconductor, Dennis Nikles, Managing Director of Deutsche Telekom IoT

Behind from left to right: Maximilian Ahrens, SVP Digital, Deutsche Telekom, Uday Patil, Head of IoT HW and Services

Credit: Oyvind Birkenes, EVP Long-Range, Nordic Semiconductor