TE is represented by Claus Kleedörfer and continues to actively shape the SPE ecosystem and standards for next-generation IIoT applications
TE Connectivity, a world leader in connectors and sensors, remains a key driver to the Single Pair Ethernet (SPE) technology with as part of the SPE Industrial Partner Network. TE, a founding member of the network, has been reelected to its board of directors. TE’s representative Claus Kleedörfer, managing director in TE’s industrial business, was appointed as its vice chair.
Together with the other network partners, TE aims to establish a comprehensive SPE ecosystem and consistent standards for communication protocols, cabling and device components driving advancement in the Industrial Internet of Things (IIoT).
The new board of directors was elected during the SPE Industrial Partner Network general meeting in April 2024. Claus Kleedörfer is one of four board members representing the founding members of the SPE IPN. The network is an equal alliance of companies that jointly define the strategic approach to establish SPE as the new Ethernet technology in the market and create the basis for rapid growth of IIoT. Since the SPE IPN was founded in 2019, TE has been represented on the board and is a leading force behind standardization and latest product introductions. TE played a key role in the roll-out of the IEC 63171-7 international electrotechnical standard that defines M12 hybrid connectors, supporting a faster acceptance of SPE interconnect technology in the industry.
“SPE means a technological leap forward for Ethernet-based single-cable connectivity solutions in smart factories,” Claus Kleedörfer said. “We believe SPE will revolutionize industrial communication in future IIoT application, that is why TE – through collaboration with other SPE IPN members – is dedicated to make SPE the standard in industrial automation.”
For more information on TE’s SPE solutions, please visit Industrial Single Pair Ethernet.
Credit: TE Connectivity
Menlo Microsystems, Inc. (Menlo Micro), a leader in high-performance switches, today announced the successful completion…
Multi-protocol modules support WiFi®, Bluetooth® and mesh networking standards Tria Technologies™, an Avnet company specializing…
The demonstration uses a silicon MZM without use of exotic materials targeting next-generation 3.2T optical…
New TOPSwitchGaN ICs more than double power output, reducing system cost, complexity, and design time…
Free, browser-based design environment streamlines engineering workflows from simulation to BOM export and purchasing THIEF…
Candela’s largest funding round to date, with the World Bank’s IFC arm joining existing investors,…