LATEST NEWS

Saving weight, space, assembly time and cost: replacing built-in cables with flexible printed circuits

Trackwise CEO Philip Johnson to present at Electric & Hybrid Aerospace Technology Symposium

Tewkesbury, May 2022:  With rapid developments taking place in aircraft design in the move towards more sustainable flight, saving weight and space has become more crucial than ever. At the world’s leading international conference dedicated to ultra-low-emission aircraft technology and full-electric flight possibilities, Trackwise CEO Philip Johnston will be presenting “Saving weight, space, assembly time and cost by replacing built-in cables with flexible printed circuits” on June 1 at the Electric & Hybrid Aerospace Technology Symposium in Frankfurt.

Flexible printed circuits (FPCs) have been used in aircraft applications since the mid-twentieth century but their use has been limited until now as they could only be manufactured in 610mm/24inch lengths.  Now this has changed: UK manufacturer Trackwise has developed a patented FPC manufacturing process, Integrated Harness Technology™ (IHT), which enables production of FPCs of almost unlimited length – last July the company announced it had manufactured and delivered a record breaking multi-layer 72 metre-long FPC.

Trackwise IHT FPCs are flexible and lightweight, offering multiple benefits and applications in the aerospace harness technology industry.   Used to replace traditional wire harnesses, multi-layer IHT FPCs not only save space and weight, but can also carry distributed sensors and other electronics, becoming a smart harness rather than just a passive interconnect. In addition, the IHT manufacturing process is roll-to-roll, machine-intensive and cost-effective, offering improved precision, repeatability and reliability.

Liat

Recent Posts

NVIDIA and AWS Expand Full-Stack Partnership, Providing the Secure, High-Performance Compute Platform Vital for Future Innovation

AWS integrates NVIDIA NVLink Fusion into its custom silicon, including the next-generation Tranium4 chip, Graviton…

2 days ago

Molex Names Top 10 Connectivity and Electronics Design Predictions for 2026, Fueled by Far-Reaching Impact of Artificial Intelligences Across Major Industries

Intensifying AI demands continue to proliferate across aerospace and defense, automotive, consumer electronics, data center,…

2 days ago

Tria Technologies to bring Qualcomm DragonwingTM IQ-6 Series to market with two new compute modules

 TRIA SM2S-IQ615 and TRIA OSM-LF-IQ615 modules enable next-generation edge AI systems across a wide range…

2 days ago

At NeurIPS, NVIDIA Advances Open Model Development for Digital and Physical AI

NVIDIA releases new AI tools for speech, safety and autonomous driving — including NVIDIA DRIVE…

2 days ago

OMRON eases PCB-relay assembly and replacement with P6K surface-mountable sockets

 P6K sockets for G6K through-hole relays ensure reliability, flexibility, and repairability  OMRON Electronic Components Europe…

2 days ago

GEOX.AI and Mitsui Sumitomo Insurance Launch AI-Powered Initiative to Assess Building Risk Across Japan

GEOX.AI, a global leader in AI-driven property intelligence, announced today a strategic partnership with Mitsui…

2 days ago