IBASE Technology Inc. (TPEx: 8050), a leading provider of robust embedded computing platforms, is proud to announce its partnership with leading Artificial Intelligence (AI) chipmaker Hailo. IBASE and Hailo are launching the 11th Gen Intel® Core™ U-Series-based (formerly Tiger Lake) ASB210-953-AI edge AI computing system, targeted at smart Artificial Intelligence of Things (AIoT) applications in multiple sectors, including smart cities, industry 4.0, and the automotive industry.
Integrated with the Hailo-8™ M.2 AI acceleration module, the ASB210-953-AI provides unparalleled performance, with up to 26 Tera-Operations Per Second (TOPS) and high-power efficiency. Measuring 180x150x72mm (WxDxH), the compact system comes with flexible expansion supporting high-speed 5G connectivity and three M.2 modules – B-Key, E-Key and M-Key (with the Hailo-8 AI module installed) – allowing customers to accelerate time to market.
“Our collaboration with Hailo enables us to offer customers edge AI inference systems with unprecedented performance and responsiveness.” said Albert Lee, Executive Vice President at IBASE. “With a best-in-class AI processor packaged in a module, the Hailo-8 is compatible with NGFF M.2 form factor, as well as with M, B+M and A+E keys that can be perfectly adopted in our ASB210-953-AI platform to execute real-time deep neural network inferencing in a wide range of market applications.”
“We are excited to partner with a market leader like IBASE to bring the performance capabilities of their deep learning solutions to a new level and enable smarter AI products,” said Liran Bar, VP Business Development at Hailo. “We look forward to offering our reimagined AI processors to more embedded computing applications via IBASE solutions.”
IBASE will be presenting a live demo with the AI solution at the coming 2022 SPS Italia, Automate, and Embedded World exhibitions. All visitors are welcome to stop by the IBASE booth when they visit the shows.
Artificial intelligence, advanced manufacturing, high-bandwidth memory and new packaging technologies are reshaping the semiconductor industry.…
Microchip Technology Incorporated, a leading provider of smart, connected, and secure embedded control solutions, today…
Mobileye is entering one of the most significant periods in its history. Alongside stronger-than-expected second-quarter…
Intel has reported its financial results for the second quarter of 2026, posting revenue of…
A Princeton University research project suggests that future RF components may no longer be designed…
Samsung Electronics and Broadcom have signed a memorandum of understanding (MoU) to expand their collaboration…