Connectors & Cables

Samtec Releases Family of AcceleRate® HP High-Performance Arrays

Basis for new PICMG COM-HPC®Interconnect Solutions

New Albany, IN: Samtec Inc., a privately held $800 MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the release of next-gen AcceleRate HP High-Performance Arrays. AcceleRate HP supports 112 Gbps PAM4 extreme performance in an ultra-micro footprint.

AcceleRate HP High-Performance Arrays feature an open-pin-field array which maximizes grounding and routing flexibility. System architects can route high-performance differential-pairs, single-ended signals and high-current voltage rails via the same interconnect.

Additionally, the 2.2 / 2.4 / 2.2 mm row pitch eases routing of differential signals. Crosstalk is improved with the increased space and the ability to add more ground vias around the differential signals.

“Samtec’s new AcceleRate HP High-Performance Arrays set the standard for high-speed 112 Gbps PAM4 performance in a small form factor,” said Michael Boone, Product Manager, High-Speed Board-to-Board at Samtec, Inc. “Fast-growing applications such as AI accelerators, ASIC emulators and next-gen edge computing platforms leverage these unique benefits.”

Key AcceleRate HP High-Performance Arrays features include:

  • Dense 0.635 mm pitch
  • Low-profile 5 mm and up to 10 mm stack heights
  • Up to 400 total pins available
  • Roadmap to 1,000+ pins
  • Data rate compatible with PCIe® 5.0 and 100 GbE
  • BGA termination for easy assembly and self-alignment

For more information on AcceleRate HP High-Performance Arrays, please visit www.samtec.com/accelerateHP.

The new PICMG COM-HPC Specification provides system and interface flexibility by adopting a pair of 400 pin connectors based on Samtec’s AcceleRate HP High-Performance Arrays. Samtec COM-HPC Connectors link carriers to Server and Client modules. They support existing and future interfaces such as PCIe 5.0 and up to 100 GbE. The connector pairs support either a 5 mm or 10 mm stack height.

For more information on Samtec COM-HPC Connectors, please download the COM-HPC Interconnect Solutions eBrochure, visit www.samtec.com/COMHPC or e-mail our technical experts at COMHPC@samtec.com>.

Liat

Recent Posts

Phinergy Completes Acceptance Tests for 72 kW Backup-Power Module, Opens Data Centre Demonstration Site

The Israeli company's aluminium-air module passed factory acceptance tests in Wisconsin. Its planned 500 kW…

2 days ago

Marvell Signs $115 Billion Enterprise-Value Deal to Acquire Lumentum

The planned all-stock transaction would combine networking silicon with lasers and optical components for AI…

2 days ago

Tower Semiconductor Reports Record $526 Million Third-Quarter Revenue

Revenue rose 33% year on year as the Israeli foundry pointed to demand for high-speed…

2 days ago

Bites Raises $40M Series A to Turn Frontline Training into a Business Performance Engine

PeakSpan Capital leads, joined by Vertex Ventures and Horizon Capital, as commercial and operations leaders…

1 week ago

Siemens introduces next generation of Sinamics G drives

New Sinamics G series creates a seamless platform for continuous-motion applications Security by Design helps…

1 week ago

Samtec to Exhibit Defense, Aerospace, and Robotics Solutions at electronica 2026

See Samtec’s solutions in Hall B2, Booth 107 Samtec, Inc., the service leader in the…

1 week ago