Connectors & Cables

Samtec Releases Family of AcceleRate® HP High-Performance Arrays

Basis for new PICMG COM-HPC®Interconnect Solutions

New Albany, IN: Samtec Inc., a privately held $800 MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the release of next-gen AcceleRate HP High-Performance Arrays. AcceleRate HP supports 112 Gbps PAM4 extreme performance in an ultra-micro footprint.

AcceleRate HP High-Performance Arrays feature an open-pin-field array which maximizes grounding and routing flexibility. System architects can route high-performance differential-pairs, single-ended signals and high-current voltage rails via the same interconnect.

Additionally, the 2.2 / 2.4 / 2.2 mm row pitch eases routing of differential signals. Crosstalk is improved with the increased space and the ability to add more ground vias around the differential signals.

“Samtec’s new AcceleRate HP High-Performance Arrays set the standard for high-speed 112 Gbps PAM4 performance in a small form factor,” said Michael Boone, Product Manager, High-Speed Board-to-Board at Samtec, Inc. “Fast-growing applications such as AI accelerators, ASIC emulators and next-gen edge computing platforms leverage these unique benefits.”

Key AcceleRate HP High-Performance Arrays features include:

  • Dense 0.635 mm pitch
  • Low-profile 5 mm and up to 10 mm stack heights
  • Up to 400 total pins available
  • Roadmap to 1,000+ pins
  • Data rate compatible with PCIe® 5.0 and 100 GbE
  • BGA termination for easy assembly and self-alignment

For more information on AcceleRate HP High-Performance Arrays, please visit www.samtec.com/accelerateHP.

The new PICMG COM-HPC Specification provides system and interface flexibility by adopting a pair of 400 pin connectors based on Samtec’s AcceleRate HP High-Performance Arrays. Samtec COM-HPC Connectors link carriers to Server and Client modules. They support existing and future interfaces such as PCIe 5.0 and up to 100 GbE. The connector pairs support either a 5 mm or 10 mm stack height.

For more information on Samtec COM-HPC Connectors, please download the COM-HPC Interconnect Solutions eBrochure, visit www.samtec.com/COMHPC or e-mail our technical experts at COMHPC@samtec.com>.

Liat

Recent Posts

Inevitable AI Group Raises $6M From Aleph to Launch AI-Native SaaS Companies

Inevitable AI Group (IAIG), an AI-native venture studio founded by veteran technology entrepreneurs, today announced…

3 hours ago

Power Integrations Demonstrates World’s First 2200 V GaN Technology for Next-Generation High-Voltage Power Systems

Power Integrations has announced the industry's first gallium nitride (GaN) technology rated at up to…

10 hours ago

Microchip Technology, in Collaboration With Micron Technology, Demonstrates High-Performance PCIe® Gen 6 Storage Architecture for AI and Data Center Infrastructure

Switchtec™ PCIe Switches and Micron® 9650 NVMe® solid state drives (SSDs) leverage next generation interface…

2 days ago

Terra Security Launches Prevention, Turning Pentest “Mitigation Advice” into a Rule that Actually Blocks the Attack

Terra Platform™ now generates and pushes the specific Web Application Firewall (WAF) and firewall rules…

2 days ago

Cato Networks Launches Agentic Threat Prevention to Predict and Mitigate AI-Assisted Attacks

Unified network and security context enables agents to map multi-stage threat paths, customize defenses per…

2 days ago

Deel Acquires AI Cybersecurity Pioneer Clarity to Build Trusted Identity for the AI Era

Company surpasses $1.5 billion ARR as profitable growth fuels its 15th acquisition to accelerate trusted…

3 days ago