NEW PRODUCTS

Tailored to perform in resonant topologies: the new 650 V CoolMOS™ CFD7

Munich, Germany – 1 October 2020 – For SMPS designs in industrial applications recent technology trends include the need for high efficiency and power density as well as increased bus voltages. This triggers the need for power devices with 650 V breakdown voltage. With its 650 V CoolMOS™ CFD7 product family Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) meets these demands. The devices are best suited for resonant topologies in soft-switching applications like telecomserversolar and off-board EV-charging.

Extending the voltage range of the renowned CoolMOS CFD7 family the 650 V device succeeds the CoolMOS CFD2. The added 650 V products match LLC and zero-voltage-switching phase-shift full-bridge topologies in which they are delivering numerous advantages compared to previous generations. The additional 50 V breakdown voltage, an integrated fast body diode, and improved switching performance make the product family a perfect fit for contemporary designs. Very low reverse-recovery charge and excellent thermal behavior add to the benefits.

The switching losses, as well as RDS(on) dependency over-temperature, are significantly reduced. The product family provides very good hard-commutation ruggedness. Thanks to the improved gate charge (Q g) and the fast switching performance, the 650 V CoolMOS CFD7 family increases efficiency over the whole load range. In the primarily targeted SMPS application, these MOSFETs provide outstanding light-load and improved full-load efficiency compared to the competition. Furthermore, the best-in-class R DS(on) enables customers to increase the power density level of SMPS at a competitive price.

Availability

The 650 V CoolMOS CFD7 in TO-220, TO-247, and TO-247 4-pin packages can be ordered now. More information is available at www.infineon.com/650V-CFD7.


SIVAN

Recent Posts

Stratasys Supercharges Airbus Production: More Than 25,000 Parts 3D-Printed this Year; 200,000+ Already in Flight

Powered by Stratasys (NASDAQ: SSYS) technology, Airbus is producing more than 25,000 flight-ready 3D-printed parts…

2 days ago

Quantum Art Raises $100 Million in Series A Round to Drive Scalable, Multi-Core Quantum Computing

Funding will support Quantum Art in reaching a 1,000-qubit commercial platform and global expansion Quantum…

5 days ago

Hud Ships First Runtime Code Sensor to Bring Production Reality to Code Generation

Hud automatically captures live service and function-level data from production- providing the missing context for…

5 days ago

Port Raises $100M Series C to Power Agentic Engineering Platform

General Atlantic leads round valuing company at $800M as Port tackles the 90% of developer…

5 days ago

Prime Security Raises $20M to Transform Product Security with the First Agentic Security Architect

Prime’s new platform accelerates development with automated security reviews and full visibility into design-level risks…

6 days ago

Safebooks AI Raises $15 Million to Automate Revenue Data Integrity for Enterprise Finance Teams

Safebooks Inc., the pioneer in Financial Data Governance, today announced its emergence from stealth and…

6 days ago