STMicroelectronics is extending the benefits of its motion-detection machine-learning core (MLC) technologies into industrial and high-end consumer applications with the latest ISM330DHCX and LSM6DSRX 6-axis iNEMO™ inertial measurement units (IMU).
The MLC performs basic AI pre-processing of motion data using about 0.001 times the power a typical microcontroller (MCU) would consume to complete the same task. As a result, IMUs featuring this IP can offload the host MCU, enabling longer battery runtime, lower maintenance, and reduced size and weight in context-aware and motion-sensing devices.
Following the launch of the first MLC-enhanced commercial IMU last year, ST’s LSM6DSRX and ISM330DHCX are ready for high-end consumer and industrial applications such as augmented/virtual reality, drone flight controls, dead-reckoning navigation systems, disk-antenna positioning systems, fleet management, container-tracking devices, and dynamic inclinometers for industrial vehicles. The consumer-grade LSM6DSRX contains a 3-axis accelerometer and a 3-axis digital gyroscope with extended full-scale angular-rate range up to ±4000dps and leading-edge performance in temperature and time. The industrial-grade ISM330DHCX comes with 10-year product-longevity assurance and is specified from -40°C to 105°C, with embedded temperature compensation for superior stability.
In each device, the MLC interacts with integrated finite-state machine (FSM) logic, which can run simple repetitive algorithms like counting steps, hits, or rotations at lower power than is possible in a microcontroller. The FSM signals to the main controller after detecting a preset number of events or after a defined time has elapsed.
Both devices are in production now. The ISM330DHCX is available as a 14-lead plastic land grid array (LGA) device, priced from $4.00 in quantities of 1000 pieces. The consumer-grade LSM6DSRX is $3.50.
Please visit www.st.com/inemo-mlc-pr for further information.
You can also read our blogpost at https://blog.st.com/lsm6dsrx-ism330dhcx/
First large-scale inference cluster with Together AI on IBM Cloud using NVIDIA HGX B300 systems to help…
The 24-month program will develop real-time process monitoring capabilities for the F3300 and F900 industrial…
OpenLight’s PDK is now available on Cadence’s EDA tools, enabling PIC development on Tower’s PH18DA…
Under the agreement, Ashtrom Industries will evaluate the material's performance and its potential integration into…
LASER COMPONENTS has expanded its offering of custom thin-film polarizers (TFPs) for high-power laser applications…