Samtec Inc., a privately held $822 MM global manufacturer of a broad line of electronic interconnect solutions, will showcase and demonstrate their latest high-performance interconnect and technologies at the PCI-SIG® Developers Conference 2019.
Samtec high-speed technologies for Silicon-to-Silicon optimization will be on display, including new high-speed, high-bandwidth optical, board-to-board and cable-to-board interconnects. 56 Gbps PAM4 and 32 GT/s product demonstrations and technical sessions will also be highlighted.
Demonstrations:
Technical Sessions:
1:00 PM Tuesday, June 18, 2019 – Kevin Burt Sr. System Architect – Optical Systems
11:30 AM Wednesday, June 19, 2019 – Steve Krooswyk Sr. SI Engineer
The demonstrations can be seen in the Samtec booth at PCI-SIG Developers Conference 2019 at the Santa Clara (CA) Convention Center. The conference is June 18-19, 2019.
Free, browser-based design environment streamlines engineering workflows from simulation to BOM export and purchasing THIEF…
Candela’s largest funding round to date, with the World Bank’s IFC arm joining existing investors,…
• Charles H. Bennett helped pioneer the foundations of quantum information science alongside co-laureate Gilles…
Delta Reaches New Milestone in Electrified Intralogistics Infrastructure Delta, a global leader in power and…
First-of-its-kind framework enables seamless integration of quantum computers with advanced accelerators to support AI-native and…
The Bundeswehr acquires a fourth Automated Driverless Testing Solution from AB Dynamics The solution removes…