LATEST NEWS

European research project Power2Power for more efficient power semiconductors launches in Dresden

The European cooperation project Power2Power has started. Over the coming three years, 43 partners from eight countries will research and develop innovative power semiconductors with more power density and energy efficiency. Power semiconductors are needed in all stages of energy conversion: generation, transmission, and use. More efficient semiconductors make a major contribution towards reducing carbon dioxide emissions in spite of the world’s growing energy needs. Universities, research institutes, small and medium-sized companies and international corporations are involved in this cooperation. Infineon Technologies Dresden GmbH & Co. KG is coordinating this project.

“Collaboration across different levels of the supply chain is a basis for the success of the European microelectronics industry,” said Dr. Reinhard Ploss, CEO of Infineon Technologies AG. “We are also pursuing this approach in the Power2Power cooperation project. In collaboration with our partners, we will be working on new power semiconductors and system architectures with higher energy efficiency. Our goal is: more power from less energy.”

The volume of the Power2Power project will be approximately €74 million. Two thirds of this will be allotted to the German partners. The European Union is funding the cooperation within the scope of the ECSEL (Electronic Components and Systems for European Leadership) program. Funding from Germany will be provided by the Federal Ministry of Education and Research and from the two states of Saxony and Thuringia. The partners from the other seven countries are also being sponsored by their national authorities.

“Saxony is the largest microelectronics cluster in Europe,” stresses Minister-President Michael Kretschmer. European cooperation, such as Power2Power, is enormously important for the continued development of Silicon Saxony. The project takes into account all stages of the supply chain and combines innovation with energy efficiency. This could make a significant contribution towards increasing the competitiveness of the European microelectronics industry. This is one of the reasons why the Free State of Saxony welcomes and supports this research project.” Dr. Herbert Zeisel, undersecretary in the German Federal Ministry of Education and Research (BMBF), emphasizes that, on the whole, the Saxon electronics cluster is an outstanding pillar for European high-tech: “Microelectronics is a key for successful industrial products from Germany and Europe. The latest trade disputes illustrate how sovereignty and autonomy are dependent on a country’s own capabilities in research and development. Power2Power shows how we can assert ourselves in the global competition. Europe, Germany, Saxony, and Thuringia are acting in concert in the ECSEL program. In the negotiations in Brussels, the BMBF will advocate for the successful ECSEL program to be continued and administration simplified after 2020.”

The European semiconductor industry employs several hundred thousand people. But in its technology-related user industry, it has a much greater leverage effect. “An important focus is the booming market for power electronics,” says Bert De Colvenaer, Executive Director ECSEL Joint Undertaking. “With regard to the global competition – especially from Asia – Power2Power will help increase the manufacturing share of European companies on the world market and further strengthen its leading positions.”

In Germany in particular, the Power2Power project will help extend the competitiveness of semiconductor production. The supply chain for power semiconductors is especially extensive, which is also evident in this this project: from special silicon wafers (Siltronic), to IGBT production at Infineon in Dresden and subsequent module production at Infineon in Warstein, to systems and the associated knowledge, for example from the SMEs EAAT and AVL and from Dresden University of Technology.

Lihi

Recent Posts

Renesas Unveils Industry’s First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…

15 hours ago

Leica Microsystems launches AI software module for consistent inspection decisions

Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…

15 hours ago

Teradyne Introduces Near-DUT Test Platform for LPDDR6, DDR6 and GDDR7

The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…

15 hours ago

ARX Robotics and DEUTZ Deliver First Ulm-Built GEREON UGVs to Ukraine

The first unmanned ground systems left the production line only 12 weeks after the two…

15 hours ago

AMD Releases Ross Agentic Assistant for Vivado and Vitis HLS Workflows

The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…

15 hours ago

Murata Begins Mass Production of 0201-Inch Three-Terminal Low-ESL MLCCs

The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…

16 hours ago