LATEST NEWS

XP Power announces new low profile 180W U-channel PSU for space-critical medical (BF), industrial & ITE applications

XP Power has launched a new range of 180-Watt U-channel AC-DC power supplies that are intended for space-constrained medical (BF), industrial and IT applications. The low-profile devices are just 29.5mm high and occupy a small 107.6mm x 62.8mm footprint, allowing them to be used in high-density designs. The units are suitable for Class I and Class II operation and offer 2 x MOPP (Means of Patient Protection) of isolation while delivering up to 94% efficiency.

The UCP180 series PSUs have an integrated 12V, 500mA fan output, eliminating the need for any external driver circuitry. When used in conjunction with a fan delivering 10CFM airflow, they can deliver 180W of power to a load – a power density of 14.2W/in³. They are also suited for use in convection cooled applications where they deliver 120W (9.4W/in³). The U-channel construction provides a robust housing, an optional cover is available for applications where the unit may be user-accessible.

Suitable for medical (BF) applications, the PSUs are approved to EN60601-1 and offer 2 x MOPP of isolation (4kV) and low leakage current (50µA), making them suitable for use in BF applied part applications. Additional approvals including IEC60950-1-1 and IEC62368-1, and EMC performance that meets EN61000-4, make them suitable for a wide range of applications including ITE and industrial.

There is a total of seven variants offering single outputs of 12V, 15V, 18V, 24V, 28V, 36V and 48V in the series. All devices have a universal input range of 85 to 264VAC and offer up to 94% efficiency while consuming <0.5W with no load. The operating temperature range is -40°C (-20°C for 180W load) to +70°C with no derating required below +50°C in either force cooled or conduction cooled applications.

Lihi

Recent Posts

NVIDIA and AWS Expand Full-Stack Partnership, Providing the Secure, High-Performance Compute Platform Vital for Future Innovation

AWS integrates NVIDIA NVLink Fusion into its custom silicon, including the next-generation Tranium4 chip, Graviton…

2 days ago

Molex Names Top 10 Connectivity and Electronics Design Predictions for 2026, Fueled by Far-Reaching Impact of Artificial Intelligences Across Major Industries

Intensifying AI demands continue to proliferate across aerospace and defense, automotive, consumer electronics, data center,…

2 days ago

Tria Technologies to bring Qualcomm DragonwingTM IQ-6 Series to market with two new compute modules

 TRIA SM2S-IQ615 and TRIA OSM-LF-IQ615 modules enable next-generation edge AI systems across a wide range…

2 days ago

At NeurIPS, NVIDIA Advances Open Model Development for Digital and Physical AI

NVIDIA releases new AI tools for speech, safety and autonomous driving — including NVIDIA DRIVE…

2 days ago

OMRON eases PCB-relay assembly and replacement with P6K surface-mountable sockets

 P6K sockets for G6K through-hole relays ensure reliability, flexibility, and repairability  OMRON Electronic Components Europe…

2 days ago

GEOX.AI and Mitsui Sumitomo Insurance Launch AI-Powered Initiative to Assess Building Risk Across Japan

GEOX.AI, a global leader in AI-driven property intelligence, announced today a strategic partnership with Mitsui…

2 days ago