– Toshiba Electronics Europe GmbH announces Enterprise Capacity Hard Disk Drives – MG08 Series, the industry’s largest capacity 16TB[1] [2] Conventional Magnetic Recording (CMR) HDD. With 33% more capacity than today’s widely adopted 12TB drives, and 14% more capacity than prior 14TB models, MG08 16TB drives are compatible with the widest range of applications and operating systems, and adapted to mixed random and sequential read and write workloads in both cloud and traditional datacenter environments.
The MG08 Series is Toshiba’s second-generation helium-sealed HDD family, and eighth-generation Enterprise Capacity HDD family. “Toshiba has delivered its industry-leading 16TB capacity and improved power efficiency by utilizing the 9-disk helium design, introduced last year in 14TB models, and its own advanced precision laser welding process to ensure the helium remains sealed inside the drive case,” comments Larry Martinez-Palomo, General Manager, HDD Business Unit, Toshiba Electronics Europe.
The MG08 features 7,200rpm performance, a 550TB per year workload rating[3], a 2.5 million-hour MTTF[4], a 512Mib cache buffer[5], and a choice of SATA and SAS interfaces—all in an industry-standard, 3.5-inch[6] form factor.
The MG08 Series further illustrates Toshiba’s commitment to advancing HDD design to meet the evolving needs for storage devices suited for use in cloud-scale servers and storage infrastructure. As data growth continues at an explosive pace, the industry-leading 16TB CMR capacity will help cloud-scale service providers and storage solutions designers to achieve higher storage densities for cloud, hybrid-cloud and on-premises rack-scale storage. Larry Martinez-Palomo from Toshiba Electronics Europe adds: “With its improved power efficiency and 16TB capacity, the MG08 Series will help lower the TCO of storage infrastructure designed for applications such as data-protection, big data aggregation, content serving and digital archiving.”
Shipments of samples of 16TB MG08 Series drives to customers will begin sequentially in Q1.
Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…
Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…
The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…
The first unmanned ground systems left the production line only 12 weeks after the two…
The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…
The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…