Power Solutions

Chassis Mount Ac-Dc Power Supplies Housed in Low Profile Metal Case

TUALATIN, Ore. — September 4, 2018 — CUI’s Power Group today announced a new line of compact, chassis mount ac-dc power supplies housed in an enclosed metal case. The VGS‑B series offers power ratings from 35 to 350 W with low 30 mm profiles and compact packages as small as 99 x 82 x 30 mm (3.89 x 3.22 x 1.18 in). Delivering no-load power consumption as low as 0.3 W and an operating temperature range of -20 to +70°C, these rugged, metal enclosed power modules are ideal for reducing standby power usage and optimizing available space within commercial and industrial applications.

CUI’s VGS‑B power supplies carry single output voltages of 12, 24, 30, and 48 Vdc, depending on the series, and an adjustable output trim. While most of the series are convection cooled, the VGS‑250B and VGS‑350B series both feature built-in cooling with a temperature-controlled fan. All models further feature a screw terminal interface, along with over current, over voltage, and over temperature protections.

Safety approvals for the VGS-B series include UL and EN 60950-1 as well as EN 55032 for conducted and radiated emissions.

The VGS‑B series are available immediately with prices starting at $14.07 per unit at 100 pieces through distribution. Please contact CUI for OEM pricing.

Summary
Product name: VGS‑B series
Availability: Stock to 13 weeks
Possible users: Commercial and industrial applications
Primary features: Metal enclosed case, low 30 mm profiles
Cost: $14.07 per unit at 100 pieces through distribution

View details for the VGS-B series

Liat

Recent Posts

AlixLabs Begins imec Pilot-Line Evaluation of Atomic-Layer Pitch Splitting

The Swedish semiconductor-equipment company has started a six-month assessment of its advanced patterning process within…

22 hours ago

Leica and Cognex Add Local AI Defect Detection to Industrial Microscopy

Aivaro AI Feature Detection identifies, classifies and measures defects inside Leica’s Enersight inspection environment without…

22 hours ago

Renesas Unveils Industry’s First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…

5 days ago

Leica Microsystems launches AI software module for consistent inspection decisions

Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…

5 days ago

Teradyne Introduces Near-DUT Test Platform for LPDDR6, DDR6 and GDDR7

The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…

5 days ago

ARX Robotics and DEUTZ Deliver First Ulm-Built GEREON UGVs to Ukraine

The first unmanned ground systems left the production line only 12 weeks after the two…

5 days ago