LATEST NEWS

NXP and Smart Columbus Continue to Partner on the Future of Smart Mobility

NXP Semiconductors N.V.(NASDAQ:NXPI), has announced the next phase in its Smart City collaboration with Columbus, Ohio, the winner of the 2016 U.S. Department of Transportation’s $40 million Smart City Challenge. NXP will contribute key technologies for smart and safe mobility to the Smart Columbus Experience Center.

On June 30, 2018, the City of Columbus celebrated the opening of its Smart Columbus Experience Center. The center allows visitors to see how new mobility options, such as connected, autonomous, shared and electric vehicles, will help make Columbus a more connected community. Hands-on educational experiences and technology demonstrations aim to show visitors how technology and innovation in transportation can grow the local economy and create ladders of opportunity for central Ohio residents.

As part of the Smart Columbus Experience Center initiative, NXP and Cohda Wirelesswill deploy a connected vehicle environment through the center’s electric vehicle test drive area so drivers can experience this future technology in person. NXP has also donated an electric motorcycle with an accompanying drone that alerts the driver to dangers or delays ahead.

As part of its commitment to Columbus, NXP will continue to contribute key mobility technologies to the Smart Columbus Experience Center, including:

  • NXP’s RoadLINK V2X technology allows cars to communicate with each other as well as with intelligent traffic infrastructures. The IEEE802.11p Dedicated Short Range Communications (DSRC) standard allows cars to securely connect to each other as well as to infrastructure. DSRC technology is the only ADAS sensor that can look around the corner and offers lowest latency in the communication.
  • Smart Card IC technology that enhances transportation for all citizens by supporting secure and convenient public transportation ticketing and payment systems, including contactless transit fare solutions.
  • Highly secure NXP Radio Frequency Identification (RFID) solutions designed to promote public safety and convenience. Smart City applications for this NXP technology include vehicle window stickers that enhance driver convenience and reduce municipal costs by eliminating the need for stop-and-pay stations in public parking spaces.

Upcoming Mobility Demonstrations at the Smart Columbus Experience Center:
Visitors will soon experience firsthand how driving electric is an exciting, convenient, sustainable and affordable way to get around Columbus. A fleet of six electric vehicles will be on display and available for test drives through a connected vehicle environment provided by NXP and Cohda Wireless. Vehicles on display or available for test drives include a BMW i3 provided by BMW, a Chevrolet Bolt provided by Dave Gill Chevrolet, a Honda Clarity provided by Honda, a Mercedes-Benz GLE 55e provided by Daimler, a Nissan LEAF provided by Nissan North America and a Toyota Prius Prime provided by Toyota. An electric motorcycle provided by NXP and a Ford Ojo electric scooter will also be on display.

Quotes:

“We’re proud to be part of the City of Columbus Experience Center,” said Peter Esser, head of U.S. Government Affairs, NXP. “Smart mobility starts with education and a desire to shape a new future. The new Smart Columbus Experience Center brings technology and education together and is unique to the smart mobility projects we are implementing around the world.”

“The Smart Columbus Experience Center was made possible through partnerships with industry leaders such as NXP and Codha wireless,” said Jordan Davis, director, Smart Cities for The Columbus Partnership. “The Experience Center is an exciting community space where we will together demonstrate how cities can use technology to improve people’s lives.”

Top Image: NXP eBike & Drone demo at the new Smart Columbus Experience Center shows how drones could send real time video of a traffic incident to a city emergency vehicle.

Lihi

Recent Posts

Avnet ASIC and Bar-Ilan University Launch Innovation Center for Next Generation Chiplets

Collaboration aims to accelerate Europe’s adoption of chiplets and advanced 2.5D and 3D chip packaging…

4 days ago

NVIDIA Acquires Open-Source Workload Management Provider SchedMD

NVIDIA will continue to distribute SchedMD’s open-source, vendor-neutral Slurm software, ensuring wide availability for high-performance…

4 days ago

Stratasys Supercharges Airbus Production: More Than 25,000 Parts 3D-Printed this Year; 200,000+ Already in Flight

Powered by Stratasys (NASDAQ: SSYS) technology, Airbus is producing more than 25,000 flight-ready 3D-printed parts…

6 days ago

Quantum Art Raises $100 Million in Series A Round to Drive Scalable, Multi-Core Quantum Computing

Funding will support Quantum Art in reaching a 1,000-qubit commercial platform and global expansion Quantum…

1 week ago

Hud Ships First Runtime Code Sensor to Bring Production Reality to Code Generation

Hud automatically captures live service and function-level data from production- providing the missing context for…

1 week ago

Port Raises $100M Series C to Power Agentic Engineering Platform

General Atlantic leads round valuing company at $800M as Port tackles the 90% of developer…

1 week ago