Toshiba Electronic Devices & Storage Corporation (“Toshiba”) is expanding its line-up of SO6L IC-output photocouplers with a new wide leadform package[1] type SO6L(LF4). Shipments start today.
The SO6L(LF4) package has a creepage distance of 8mm, which meets the industry’s standard creepage distance for SO6L.
To date, Toshiba has offered eight photocouplers in the SO6L(LF4) package: three for high-speed communication applications and five for IGBT/MOSFET drive applications. Now the company has added six photocouplers in the SO6L(LF4) package to its product portfolio: three for high-speed communication applications and three for IGBT/MOSFET drive applications.
The SO6L(LF4) package is footprint-compatible with the SDIP6(F type) package with wide lead-forming option and a maximum package height of 4.15mm. In addition, the SO6L(LF4) package has a maximum height of 2.3mm, which is approximately 45% thinner than the conventional SDIP6(F type) package. Its low profile package contributes to system size reduction and can be mounted in height-restricted locations, such as the back of a board.
Toshiba will release more IC-output photocouplers as direct replacements for the current SDIP6 (F type) package.
The latest Gartner market report recognizes Toshiba as the leading manufacturer of optocouplers by sales in 2015 and 2016, with 23% of sale-based market share in CY2016. (Source: Gartner “Market Share: Semiconductor Devices and Applications Worldwide 2016” 30 March, 2017)
Toshiba will continue to deliver products that meet the needs of customers by promoting the development of a diverse portfolio of photocouplers and photorelays tailored to market trends.
Prime’s new platform accelerates development with automated security reviews and full visibility into design-level risks…
Safebooks Inc., the pioneer in Financial Data Governance, today announced its emergence from stealth and…
AWS integrates NVIDIA NVLink Fusion into its custom silicon, including the next-generation Tranium4 chip, Graviton…
Intensifying AI demands continue to proliferate across aerospace and defense, automotive, consumer electronics, data center,…
TRIA SM2S-IQ615 and TRIA OSM-LF-IQ615 modules enable next-generation edge AI systems across a wide range…
NVIDIA releases new AI tools for speech, safety and autonomous driving — including NVIDIA DRIVE…