NEW PRODUCTS

New ACEPACK™ Power Modules from STMicroelectronics Deliver Advanced Performance and Economy

STMicroelectronics’ new ACEPACK™ (Adaptable Compact Easier PACKage) modules provide cost-effective and highly integrated power conversion for 3-30 kW applications including industrial motor drives, air conditioners, solar generators, welders, battery chargers, UPS controllers, and electric vehicles.

ST’s space-efficient, low-profile ACEPACK technology combines high power density with reliability in economical plastic package. Features include optional solder-free press-fit connections, which simplify assembly as an alternative to conventional soldered pins, and metal screw clamps that enable fast and reliable mounting.

Inside, ST’s third-generation field-stop trench IGBTs deliver today’s best combination of low on-resistance and high switching performance. Two configurations are available, giving a choice of sixpack modules that contain six IGBTs with freewheel diodes as a three-phase inverter, or Power Integrated Modules (PIM) that provide a complete driver power stage. The PIMs are Converter-Inverter-Brake (CIB) devices that integrate a three-phase rectifier, a three-phase inverter, and a braking chopper for handling energy returned from the load. Both types also contain an NTC thermistor for temperature sensing and control.

Various PIM/CIB and sixpack devices are available in ACEPACK 1 or larger ACEPACK 2 sizes, featuring either 650V or 1200V IGBTs and current ratings from 15A to 75A. The internal layout of the modules is optimized for low stray inductance and low EMI emissions, which simplifies meeting EMC regulations, and 2.5kV isolation ensures robust performance under harsh operating conditions. All modules are specified up to 175°C maximum operating temperature, giving designers extra freedom to optimize heatsink size and power dissipation.

Lihi

Recent Posts

Avnet ASIC and Bar-Ilan University Launch Innovation Center for Next Generation Chiplets

Collaboration aims to accelerate Europe’s adoption of chiplets and advanced 2.5D and 3D chip packaging…

4 days ago

NVIDIA Acquires Open-Source Workload Management Provider SchedMD

NVIDIA will continue to distribute SchedMD’s open-source, vendor-neutral Slurm software, ensuring wide availability for high-performance…

5 days ago

Stratasys Supercharges Airbus Production: More Than 25,000 Parts 3D-Printed this Year; 200,000+ Already in Flight

Powered by Stratasys (NASDAQ: SSYS) technology, Airbus is producing more than 25,000 flight-ready 3D-printed parts…

7 days ago

Quantum Art Raises $100 Million in Series A Round to Drive Scalable, Multi-Core Quantum Computing

Funding will support Quantum Art in reaching a 1,000-qubit commercial platform and global expansion Quantum…

1 week ago

Hud Ships First Runtime Code Sensor to Bring Production Reality to Code Generation

Hud automatically captures live service and function-level data from production- providing the missing context for…

1 week ago

Port Raises $100M Series C to Power Agentic Engineering Platform

General Atlantic leads round valuing company at $800M as Port tackles the 90% of developer…

1 week ago