Test Equipment

Anritsu Announces New Test Platform to Support Qualcomm Technologies’ 5G Chipset Development

Anritsu Corporation announces its new 5G test platform to help support test development for Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, on 5G chipsets.

Anritsu, a leader in mobile communications testing, is working with Qualcomm Technologies to support test development for devices such as baseband chips. Anritsu’s test platform for 5G, the next generation communication system beyond 4G LTE, is designed to support Qualcomm Technologies in its effort to commercialize next generation 5G NR technologies.

By offering measurement solutions supporting early deployment of 5G services, Anritsu will play a key role in the transition from 4G LTE to 5G systems.

Anritsu designed its new 5G test platform for the latest technologies, such as wideband signal processing and beamforming architectures, required by ultrafast large-capacity 5G communications. The all-in-one platform supports millimeter-wave and sub-6 GHz RF tests as well as protocol tests. The 3GPP non-standalone specifications for assuring co-existence with both 4G and 5G networks require an advanced and stable 4G test environment; Anritsu’s 10 years of experience in supplying 4G test solutions will help facilitate smooth and early development of 5G NR.

Mr. Jon Detra, vice president, engineering, Qualcomm Technologies, Inc., commented, “We are pleased to continue working with Anritsu in order to make 5G NR networks and mobile devices a commercial reality in 2019.”

Tsutomu Tokuke, General Manager, Mobile Solutions Div., Anritsu Corporation, said, “It is a great honor to work Qualcomm Technologies in advancing 3G and 4G communications to the next level with development and testing of 5G devices.”

 

 

 

Lihi

Recent Posts

NVIDIA and AWS Expand Full-Stack Partnership, Providing the Secure, High-Performance Compute Platform Vital for Future Innovation

AWS integrates NVIDIA NVLink Fusion into its custom silicon, including the next-generation Tranium4 chip, Graviton…

4 days ago

Molex Names Top 10 Connectivity and Electronics Design Predictions for 2026, Fueled by Far-Reaching Impact of Artificial Intelligences Across Major Industries

Intensifying AI demands continue to proliferate across aerospace and defense, automotive, consumer electronics, data center,…

4 days ago

Tria Technologies to bring Qualcomm DragonwingTM IQ-6 Series to market with two new compute modules

 TRIA SM2S-IQ615 and TRIA OSM-LF-IQ615 modules enable next-generation edge AI systems across a wide range…

4 days ago

At NeurIPS, NVIDIA Advances Open Model Development for Digital and Physical AI

NVIDIA releases new AI tools for speech, safety and autonomous driving — including NVIDIA DRIVE…

4 days ago

OMRON eases PCB-relay assembly and replacement with P6K surface-mountable sockets

 P6K sockets for G6K through-hole relays ensure reliability, flexibility, and repairability  OMRON Electronic Components Europe…

4 days ago

GEOX.AI and Mitsui Sumitomo Insurance Launch AI-Powered Initiative to Assess Building Risk Across Japan

GEOX.AI, a global leader in AI-driven property intelligence, announced today a strategic partnership with Mitsui…

4 days ago