LATEST NEWS

VTT acquires a new test system for the production of silicon photonics

VTT has acquired a system from SemiProbe to perform automatic and simultaneous Electro-Optical tests at Wafer Level (E/O WLT).  The new and improved system will support both research and the SiPh production activities at VTT Memsfab.

The system, installed and operational at Micronova facility is able to handle 6″and 8″ wafers and can be loaded with 2 full cassettes (25 wafers each) containing several hundred-thousands of E/O devices to test. Test data are automatically acquired in customer-specified formats and let them available for analytics almost in real time, providing essential feedback and better understanding about production yield, process tuning needs or possible new chip design iterations.

The prober is also expected to work with a minimum level of surveillance during day shifts and be completely unmanned along the overnight shift, after loading operations.

“Leveraging on our expertise, we want to continuously improve the quality of complex testing services we are offering to our customers. We are excited to use this automatic probing station where we contribute applying our unique fiber probing and alignment know-how, allowing the machine to simultaneously probe each device optically and electrically (RF up to 50GHz)”, says Giovanni Delrosso, Senior Scientist and Project Manager at the Photonics Integration team.

According to Timo Aalto, Research Team Leader, silicon photonics has been one of the fastest growing areas at VTT in the past few years.

“In 2016 we delivered thousands of SiPh chips for our customers. In 2018, the volume is targeted to reach more than 1 million tested chips”, E/O Wafer Level Test is therefore vital in our R&D and manufacturing value chains”, Aalto says.

Lihi

Recent Posts

Cognex to Acquire RealSense, Expanding Machine Vision Leadership into High-Growth Robotic Perception Market

Cognex Corporation (NASDAQ: CGNX), the global technology leader in industrial machine vision, today announced that…

8 hours ago

Jura and SEALSQ Plan Swiss Post-Quantum Semiconductor Centre

The Republic and Canton of Jura has signed a memorandum of understanding with SEALSQ and…

9 hours ago

Molex Announces VersaBeam Mini to Advance Ultra-Dense, Eye-Safe Optical Interconnects for Next-Generation AI Data Centers

Delivers 3x density improvement in an ultra-compact form factor, supporting up to 3,456 fibers in…

10 hours ago

Chamelio Raises $26M to Replace Legacy CLM with AI-Native In-House Legal Operations

Powered by agentic AI, Chamelio’s platform is primed to replace outdated legacy contract lifecycle management…

10 hours ago

UVJC Prepares Commercial Maskless Vapor-Jet Deposition System

Universal Vapor Jet Corporation will introduce NovaJet, its first commercial thin-film deposition system based on…

10 hours ago

Lessengers Builds 3.2T Near-Packaged Optics on a Glass Substrate

Lessengers has unveiled a 3.2 Tbit/s near-packaged-optics platform that uses a glass packaging core, through-glass…

10 hours ago