LATEST NEWS

Nexperia supports Engineers of the Future with sponsorship of University Robotics & AI team

Nexperia, the former Standard Products division of NXP, today announced that it is proud to be the main industry sponsor for the University of Twente’s RoboTeam, a multidisciplinary student group that aspires to innovate in both robotics and artificial intelligence. One channel that the team is using to achieve this ambition is by competing in RoboCup 2017, the world championship of robot soccer in Japan (July 25-31). https://www.robocup.org/. RoboTeam Twente will participate in the Small Size League, which focuses mainly on artificial intelligence.

Nexperia supports the team both financially and with products and technical support. “It is important for Nexperia to sponsor RoboTeam Twente as we believe we must facilitate the engineers of the future and at the same time be inspired and triggered by their innovations and ideas”, said Gerton Jansen, SVP Marketing and Sales Nexperia.  “It is a win-win situation: RoboTeam Twente will take part in the Small Size League – you could say we fulfill a similar role as the industry leader miniature packaging.”

Added Jim Hoekstra, Software & External Relations: “We are very grateful to be sponsored by Nexperia, especially since we share common philosophies concerning efficiency, miniaturization, quality and innovation. We are looking forward to a highly-fruitful cooperation with Nexperia, which has begun very well with the immediate delivery of products straight after our agreement was signed.”

RoboTeam Twente’s website, ‘powered by Nexperia’, can be found at https://roboteamtwente.nl/

Lihi

Recent Posts

Renesas Unveils Industry’s First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…

24 hours ago

Leica Microsystems launches AI software module for consistent inspection decisions

Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…

24 hours ago

Teradyne Introduces Near-DUT Test Platform for LPDDR6, DDR6 and GDDR7

The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…

1 day ago

ARX Robotics and DEUTZ Deliver First Ulm-Built GEREON UGVs to Ukraine

The first unmanned ground systems left the production line only 12 weeks after the two…

1 day ago

AMD Releases Ross Agentic Assistant for Vivado and Vitis HLS Workflows

The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…

1 day ago

Murata Begins Mass Production of 0201-Inch Three-Terminal Low-ESL MLCCs

The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…

1 day ago