Advantest’s T5851 Tester Wins Best of Show Award at Flash Memory Summit

Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) earned a Best of Show Award with its T5851 tester at the 11th Annual Flash Memory Summit, held August 9-11 in Santa Clara, Calif. The awards presented at the summit provide the highest honors in the flash memory and solid-state storage industry.

In the category of Most Innovative Flash Memory Technology, Advantest’s T5851 system was recognized for changing the way flash memory is tested to improve the performance, availability, endurance and/or energy efficiencies of electronic products. The T5851 provides multi-protocol support in one tool for high-performance universal flash storage (UFS) devices and PCIe BGA solid-state drives, minimizing customers’ capital investments and deployment risks. Its tester-per-DUT architecture and proprietary hardware accelerator deliver the fastest test times in the industry, contributing to a lower cost of test.

The T5851 is designed for high-volume testing, as well as reliability and qualification testing, of protocol NAND devices. This flexible system can be configured to test up to 768 devices in parallel by using an automated component handler such as Advantest’s M6242 system.

“We are proud to receive this industry acknowledgment of the innovative advances that we bring to the market for non-volatile memories, which are so vital to low-power, mobile applications,” said Masuhiro Yamada, executive officer with Advantest. “Our T5851 system is designed for system-level testing of these devices while still providing the reliability, low-cost and high-volume productivity that the market needs.”

“The booming market for new consumer electronics utilizing flash storage creates the challenge for a scalable platform for testing flash memory,” said Jay Kramer, chairperson of the Flash Memory Summit’s Awards Program. “We are proud to select Advantest’s T5851 for the Best of Show Technology Innovation Award as it is available in both production and engineering models to address a wide range of test program environments while providing the versatility to test the memory ICs powering smart phones, tablets and ultra-portable laptops.”

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