Categories: LATEST NEWS

TactoTek awarded EUR 2.5 Million EU Horizon 2020 grant to mass produce injection molded electronics

TactoTek Solution and Capabilities Recognized As Key Enabling Technology That Enables and Drives Innovation and EU Competitiveness

OULU, FINLAND – TactoTek, a leading manufacturer of 3D injection molded structural electronics (IMSE) solutions today announced that it has been named a recipient of a €2.5 million EU Horizon 2020 award to mass produce injection molded electronics (IME) solutions.

Horizon 2020 is the financial instrument of Innovation Union, a Europe 2020 flagship initiative aimed at securing Europe’s global competitiveness and whose charter includes supporting new, breakthrough enabling and industrial technologies that strengthen Europe’s industrial capabilities.

“TactoTek is honored to be selected by the H2020 investment committee,” said Jussi Harvela, CEO of TactoTek, “our innovative solutions cross-cut markets and already have strong appeal in automotive, home appliances and wearable technology. H2020 funding will accelerate our ability to serve more customers and help TactoTek bring our customers’ solutions to market faster, whether they are mass produced by TactoTek or by manufacturers who license TactoTek technology.”

TactoTek’s solutions integrate printed circuitry, printed touch controls and discrete electronic components, such as LEDs and ICs, into light, 3D injection molded plastics as thin as 2mm. By incorporating circuitry and electronics directly into plastic structures, TactoTek enables brands to design innovative form factors and consolidate electronics into a single 3D structure.

TactoTek maintains a staff of engineers to help customers adapt their traditional electronics designs into IMSE solutions. The company prototypes and manufactures products in its Kempele, Finland, factory that includes a complete, vertically-integrated production capability; mass production can be performed by TactoTek or TactoTek-licensed production partners.

Liat

Recent Posts

Apiiro Launches AI-SAST That Detects, Validates and Fixes Code Vulnerabilities with Software Architectural Context from Code-to-Runtime

New capability combines AST scanning, LLM reasoning, and Apiiro Deep Code Analysis (DCA) to deliver…

10 hours ago

Avnet ASIC and Bar-Ilan University Launch Innovation Center for Next Generation Chiplets

Collaboration aims to accelerate Europe’s adoption of chiplets and advanced 2.5D and 3D chip packaging…

5 days ago

NVIDIA Acquires Open-Source Workload Management Provider SchedMD

NVIDIA will continue to distribute SchedMD’s open-source, vendor-neutral Slurm software, ensuring wide availability for high-performance…

6 days ago

Stratasys Supercharges Airbus Production: More Than 25,000 Parts 3D-Printed this Year; 200,000+ Already in Flight

Powered by Stratasys (NASDAQ: SSYS) technology, Airbus is producing more than 25,000 flight-ready 3D-printed parts…

1 week ago

Quantum Art Raises $100 Million in Series A Round to Drive Scalable, Multi-Core Quantum Computing

Funding will support Quantum Art in reaching a 1,000-qubit commercial platform and global expansion Quantum…

1 week ago

Hud Ships First Runtime Code Sensor to Bring Production Reality to Code Generation

Hud automatically captures live service and function-level data from production- providing the missing context for…

1 week ago