Cadence Innovus Implementation System Qualified on Samsung 10nm FinFET Process

Enables systems and semiconductor companies to deliver advanced-node designs to market faster

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the Cadence® Innovus™ Implementation System has been qualified for Samsung Foundry’s latest 10-nanometer (10nm) process. The Innovus Implementation System is a next-generation physical implementation tool with integrated signoff engines that have been validated for Samsung designs, providing customers with the fastest path to implementation and closure and optimal power, performance and area (PPA).

The Innovus Implementation System offers customers key technologies for using the Samsung 10nm process including the GigaPlace™ solver-based placement technology, a slack-driven, pin access-aware placer that improves electrical and physical design convergence at advanced nodes. The tool also offers integration with the Cadence Quantus™ QRC Extraction Solution, the Tempus™ Timing Signoff Solution, the Voltus™ Power Integrity Solution and the Physical Verification System, all of which enable design convergence for faster design closure. The Innovus Implementation System incorporates a massively parallel architecture that increases capacity and drives better turnaround time without compromising PPA. For more information on the Innovus Implementation System, please visit www.cadence.com/innovus.

“We have collaborated with Samsung to enable customers to deploy production flows on 10nm FinFET designs in order to achieve the best PPA and overcome design complexity to meet aggressive time-to-market demands,” said Dr. Anirudh Devgan, senior vice president and general manager of the Digital and Signoff Group at Cadence. “We are actively working with customers on new designs on the Samsung 10nm process using the Innovus Implementation System, and we are seeing early successes that can enable these designers to stay in front of the competition.”

Liat

Recent Posts

60W DOE Level VII ready IP42-sealed wall-mount adapters for medical, home healthcare, and industrial applications

XP Power introduces the AMF60 series of 60W wall-mount AC-DC power supplies for medical, home…

2 days ago

ROHM launches an Ultra-Compact Wireless Power Chipset for Wearables

ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 -…

2 days ago

Microchip Expands its Family of Post-Quantum Ready Root of Trust Controllers for Next Generation Systems

Platform Root of Trust and secure boot controllers help system architects prepare for emerging mandates…

2 days ago

AU10TIX Advances Privacy-First Approach to Age Assurance as Regulatory Pressure Increases

AU10TIX, a global leader in identity verification and fraud prevention, is further advancing its privacy-first approach to age…

2 days ago

New Samtec SMA Interconnects Capable of 26.5 GHz

Samtec, Inc. announces availability of 26.5 GHz SMA interconnects supporting test & measurement, military, aerospace…

2 days ago

Tower Semiconductor and Axiro Semiconductor Deliver High-Power, High-Efficiency SiGe ICs for Secure U.S. Defense Applications

Leveraging Tower's advanced SiGe technology, these U.S.-fabricated Beamforming ICs achieve superior performance, and strengthen secure…

3 days ago