New NXP and Zentri Cloud Connectivity Kit Reduces Time to Market for Developing IOT Devices

Eindhoven, Netherlands, NXP Semiconductors N.V. (NASDAQ: NXPI) today unveiled the LPC43S67-A70CM Cloud Connectivity Kit designed to significantly reduce time-to-market for deploying IoT products. The kit helps designers bridge the gap between un-connected embedded products to cloud-connected products without the need for deep expertise in security, Wi-Fi stacks, device commissioning, and cloud service APIs.

NXP collaborated with ecosystem partner, Zentri, known for creating a single platform stack that helps companies build connected products for the IoT market, to combine the NXP LPC43S67 microcontroller, A7001CM secure element and NTAG I2C NFC, a Murata SN8000 802.11b/g/n module, with the Zentri Secure Connected Product Platform. The kit is designed to simplify the effort and reduce the time needed to create and deploy secure, connected products such as vending machines, personal health devices and interactive displays, industrial products used for factory automation, industrial gateways and diagnostic equipment, as well as consumer products used in the home, such as washing machines and thermostats.

The LPC43S67-A70CM Cloud Connectivity Kit jumpstarts all three key aspects of developing an IoT product:

• security and connectivity of the physical device, including secure cloud-based device management for provisioning and remote management
• developing applications for end users and connected users, and
• protocol-agnostic cloud connectivity to support the connected functionality and services.

“Embedded product designers are under tremendous pressure to add IoT functionality to their next-generation products,” said Asit Goel, Sr. VP & GM BL Secure Monitoring and Control, NXP Semiconductors. “But mastering security, wireless connectivity, cloud connectivity, device management, and mobile app development presents most companies with steep learning curves that delay time to market by months, often years. The LPC43S67-A70CM Cloud Connectivity Kit combines security and connectivity expertise from NXP and Zentri to help developers overcome these challenges with limited in-house expertise and without compromising time to revenue.”

“Zentri is excited to partner with NXP to deliver our Secure Connected Product Platform as an integral part of the LPC43S67-A70CM Cloud Connectivity Kit,” said Paul Fulton, Chief Executive Officer, Zentri. “The Kit makes it easy for developers to stay focused on releasing embedded products, deliver a great connected experience to all users and, ultimately, to enable product companies to realize new, recurring business models with premium product features and services.”

The LPC43S67-A70CM Cloud Connectivity Kit includes:

•  Reference hardware: LPCXpresso43S67 board based on the NXP LPC43S67 microcontroller and A7001CM secure element, an NXP LPC General Purpose Shield, an NXP NFC NTAG I2C board, and Murata SN8000 802.11b/g/n (SD card)
• Zentri Secure Connected Product Platform: the ZentriOS, ZentriOS SDK, ZentriDMS, and Zentri Mobile App SDK

Availability
The LPC43S67-A70CM Cloud Connectivity Kit will available from NXP distributors in December. Production quantities of the NXP LPC43S67 microcontroller, A7001CM secure element, and NFC NTAG I2C are available now from NXP distributors.