Categories: Medical

Vishay Intertechnology Dual-in-Line Thin Film Resistor Networks Enable Higher-Precision Voltage Dividers and Unity Gain Op Amps for Medical and Instrumentation Electronics

Devices Feature Compact 8-Pin MSOP Package With 25 mil Pitch and 1.10 mm Seated Height

MALVERN, Pa. — Dec. 1, 2015 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of surface-mount, high-precision dual-in-line thin film resistor networks featuring improved performance and a smaller size than previous-generation SOIC devices. Offering a slim maximum seated height of 1.10 mm, the Vishay Dale Thin Film MORN series delivers lower TCR tracking to ± 1 ppm/°C, tighter ratio tolerances to ± 0.01 %, and excellent long-term ratio stability of 0.015 % after 2000 hours at +70 °C. 

MORN series devices feature four isolated resistors with resistance values from 400 Ω to 100 kΩ. Offered in compact 25-mil-pitch, 8-pin MSOP packages — in accordance with JEDEC MO-187, variation AA — the resistor networks provide a rugged molded construction and typical power ratings of 50 mW per resistor element. 

The integrated construction of MORN resistor networks allows for higher precision over discrete SMD chips, making the devices ideal for precision voltage dividers and unity gain operational amplifier circuitry. Typical end products will include telecommunications, industrial, process control, and medical instrumentation. 

The devices feature extremely low noise of ≤ -30 dB and voltage coefficients of 0.1 ppm/V, and they operate over a wide temperature range of -55 °C to +125 °C. MORN series devices are RoHS-compliant and halogen-free.

Samples and production quantities of the new resistor networks are available now, with lead times of eight to 10 weeks for larger orders. Pricing for U.S. delivery starts from $0.88 to $3.55 per piece in 1,000-piece quantities and varies by ratio tolerance and other performance characteristics.

Liat

Recent Posts

Analog Devices to Acquire Alif Semiconductor for $1.35 Billion, Expanding Its Edge AI Platform

The planned acquisition will combine Analog Devices’ sensing, signal-processing, power and connectivity technologies with Alif’s…

20 hours ago

Kyocera and Tohoku University Integrate Optical Isolator Directly on Silicon Photonics

A locally applied laser-annealing process enabled the researchers to crystallise magneto-optical garnet without exposing the…

20 hours ago

NVIDIA and Palantir Deploy AI Stack to Manage NVIDIA’s Supply Chain

The system combines NVIDIA Nemotron open models with Palantir Foundry, AIP and Ontology. Its first…

4 days ago

Infineon extends collaboration with SolarEdge to enable solid-state protection for 800 VDC AI data centers

Companies extend collaboration into solid-state circuit breaker (SSCB) technology in line with leading industry framework…

5 days ago

Toyota and Rivian Adopt Stratasys’ New F870™ to Accelerate Factory-Floor Manufacturing Applications at Scale

New industrial FDM® platform expands Stratasys' production-grade portfolio with the longest heated build capacity in…

5 days ago

Imec advances scalable superconducting technology with world-first NbTiN circuits and 30nm interconnects

New superconducting digital program brings together foundries, system companies and hyperscalers around industry needs in…

6 days ago