Commercial

Epson Shipping Samples of Six New 16-bit MCUs in the S1C17M2 Series

http://global.epson.com/ Comments Off on Epson Shipping Samples of Six New 16-bit MCUs in the S1C17M2 Series

Seiko Epson Corporation has begun shipping samples of the S1C17M20, a low-power 16-bit microcontroller unit (MCU) with on-chip flash memory. This new MCU is ideal for a wide range of... Read More

VPG Foil Resistors Announces Ultra-High Precision Military and Space Grade Resistors for High-Performance Current Sensing within Mission-Critical Applications

www.vishaypg.com Comments Off on VPG Foil Resistors Announces Ultra-High Precision Military and Space Grade Resistors for High-Performance Current Sensing within Mission-Critical Applications

The VPG Foil Resistors product group of Vishay Precision Group (NYSE: VPG) (www.vpgfoilresistors.com), manufacturers of the industry’s most precise and stable precision resistors, today introduced the Model 303337 ultra-high precision... Read More

Maxim’s Dual Channel Transceiver Adopted by Omron for IO-Link Sensor Applications

www.maximintegrated.com Comments Off on Maxim’s Dual Channel Transceiver Adopted by Omron for IO-Link Sensor Applications

Maxim Integrated Products, Inc. (NASDAQ:MXIM) announced that its MAX14827A dual IO-Link® transceiver has been adopted by Omron Corporation. The high-performing device from Maxim, which utilizes IO-Link sensors to reduce maintenance and... Read More

20V, 20A Monolithic Synchronous Silent Switcher®2 Buck Regulator Reduces EMI & Enables High Power Density Applications

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Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTC7150S, a 20V, 20A monolithic synchronous buck converter with differential VOUT remote sensing. The device’s unique phase lockable controlled... Read More

Toshiba Memory Corporation Develops World’s First 3D Flash Memory with TSV Technology

www.toshiba-memory.co.j Comments Off on Toshiba Memory Corporation Develops World’s First 3D Flash Memory with TSV Technology

Toshiba Memory Corporation, the world leader in memory solutions, today announced development of the world’s first[1] BiCS FLASH™ three-dimensional (3D) flash memory[2] utilizing Through Silicon Via (TSV)[3] technology with 3-bit-per-cell (triple-level cell, TLC)... Read More