Microchip Teams Up with Intelligent Hardware Korea (IHWK) to Develop an Analog Compute Platform to Accelerate Edge AI/ML Inferencing

New-Tech Magazines Group Ltd. Comments Off on Microchip Teams Up with Intelligent Hardware Korea (IHWK) to Develop an Analog Compute Platform to Accelerate Edge AI/ML Inferencing

Using Microchip’s memBrain™ nonvolatile in-memory compute technology and working with universities, IHWK is creating a SoC processor for neurotechnology devices CHANDLER, Ariz., September. 13, 2023 — To address the rapid... Read More

u-blox introduces its newest dual-band GNSS module, optimal for meter-level position accuracy in urban environments

New-Tech Magazines Group Ltd. Comments Off on u-blox introduces its newest dual-band GNSS module, optimal for meter-level position accuracy in urban environments

The u-blox NEO-F10N is based on the u-blox F10 platform, equipped with L1/L5 dual-band technology and effective multipath mitigation. Thalwil, Switzerland – September 14, 2023 – u-blox (SIX:UBXN), a global... Read More

Automotive Cybersecurity Management Certified to ISO/SAE 21434

Renesas Automotive MCU and SoC Cybersecurity Management Certified to ISO/SAE 21434:2021

New- Tech Magazine Group Comments Off on Renesas Automotive MCU and SoC Cybersecurity Management Certified to ISO/SAE 21434:2021

A Structured Cybersecurity Management System Ensures Holistic Cybersecurity Practices Across The Entire Device Life Cycle OKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced... Read More

Infineon adds 650 V TOLL portfolio to its CoolSiC™ MOSFET family for better thermal performance, power density, and easier assembly

Infineon adds 650 V TOLL portfolio to its CoolSiC™ MOSFET family for better thermal performance, power density, and easier assembly

New- Tech Magazine Group Comments Off on Infineon adds 650 V TOLL portfolio to its CoolSiC™ MOSFET family for better thermal performance, power density, and easier assembly

Munich, Germany – 19 July, 2023 – As digitalization, urbanization, and the rise of electro-mobility continue to shape the rapidly evolving world, the demand for power consumption is reaching unprecedented... Read More

Teledyne e2v and Infineon partner on optimized processor boot solution for high reliability edge computing space systems

Teledyne e2v and Infineon partner on optimized processor boot solution for high reliability edge computing space systems

New- Tech Magazine Group Comments Off on Teledyne e2v and Infineon partner on optimized processor boot solution for high reliability edge computing space systems

Munich, Germany, and Grenoble, France – 6 July, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Teledyne e2v (NYSE:TDY) have developed a reference design for the implementation... Read More